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sp168gn

特点

●  优异的机械加工性,适合压合工艺。

●  极小流胶,可挠曲加工极少碎屑。

●  高tg无卤。

应用领域

适合用作散热板、多层板及软硬结合板粘结层
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items method condition unit typical value
tg ipc-tm-650 2.4.25 dsc 165
td ipc-tm-650 2.4.24.6 5% wt. loss 380
cte (z-axis) ipc-tm-650 2.4.24 before tg ppm/℃ 70
after tg
ppm/℃ 300
t288 ipc-tm-650 2.4.24.1 tma min >30
thermal stress ipc-tm-650 2.4.24.13 288℃, solder dip -- >600s
dissipation constant (dk) ipc-tm-650 2.5.5.9 1ghz -- 3.85
dissipation factor (df) ipc-tm-650 2.5.5.9 1ghz -- 0.013
peel strength ipc-tm-650 2.4.8 copper (1/2 oz) n/mm 1.2
copper (1 oz) n/mm 1.5
cvl n/mm 1.0
water absorption ipc-tm-650 2.6.2.1 e-1/105_d-2/23 % 0.14
flammability ul94 e-24/125
rating v-0

remarks:

1.specimenthickness: 0.8mm. all the typical value listed above is for your referenceonly,  please turn to shengyi technologyco., ltd. for detailed information.

2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.

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