shengyi technology co., ltd.-小9直播体育免费直播下载ios




●  high bonding strength, gooddimensional stability.

●  excellent solderingreliability, chemical resistance and electrical properties.

●  low adhesive flowing, good processability,suitable for both fast and traditional laminationstyle.

●  compatible with eu rohs directive, free of pb,hg,cd,cr6 ,pbb,pbde,etc.

application area

multi-layer fpc and rigid-flex pcb, etc..

  • product performance
  • product certificate
  • data download
items method condition unit typical value
peel strength(90°)* ipc-tm-650 2.4.9d accepted n/mm 1.0
288℃、5s 0.9
solder resistance ipc-tm-650 2.4.13.f 288℃、10s -

no delamination

chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >90
electric strength ipc-tm-650 d-48/50 d-0.5/23 kv/mm 100
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 2.51×107
surface resistance ipc-tm-650 2.5.17e c-96/35/90
dielectric constant(10ghz) spdr c-24/23/50 - 3.4
dissipation factor(10ghz) spdr c-24/23/50
- 0.02
resin flow ipc-tm-650 180℃/10 60s,100kg/cm2
mm <0.15


*testing after laminating with shining side of copper foil and pi film insuitable condition.

1.certified to ipc-4203/19 unsupported epoxy adhesive

2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.