shengyi technology co., ltd.-小9直播体育免费直播下载ios

product

sf206b

characteristic

  • low dielectric constant, low dissipation loss

  • the copper has excellent peel strength with the pi film

  • halogen-free, flammabilityul94 vtm-0

  • excellent thermal agingresistance ,chemicalresistance and electrical property

  • good processability, suitable for traditional lamination style.

  • compatible with eu rohsdirective, freeof pb,hg,cd, cr6 ,pbb,pbde, etc ..

application area

be used in high frequency multi-layer fpc and rigid-flex pcb as the bonding lay
  • product performance
  • product certificate
  • data download
items method condition unit typical value
peel strength(90°)* ipc-tm-650 2.4.9d accepted n/mm 1.1
288℃、5s 1.1
solder resistance ipc-tm-650 2.4.13.f 288℃、10s -

no delamination

chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >90
electric strength
ipc-tm-650 2.5.6.2a
d-48/50 d-0.5/23
kv/mm
118.9
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 4.1×109
surface resistance ipc-tm-650 2.5.17e c-96/35/90
1.4×106
dielectric constant(10ghz) spdr c-24/23/50 - 2.5
dissipation factor(10ghz) spdr c-24/23/50 - 0.003
resin flow ipc-tm-650 2.3.17.1 180℃/10 60s,100kg/cm2
mm <0.15
flammability
ul94
e-24/125
rating
v-0

remarks:

*testing after laminating with shining side of copper foil in suitablecondition.

1.certified to ipc-4203/20 unsupported polyesteradhesive

2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.

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