shengyi technology co., ltd.-小9直播体育免费直播下载ios

product

sf325c

characteristic

●  excellent anti-ionmigration, no dendrite.

●  halogen free, flammabilityul94 vtm-0.

●  high bonding strength, gooddimensional stabilityand thermal resistance.

●  low adhesive flowing, good processability,suitablefor both fast andtraditional lamination style.

●  compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde,etc..


application area

coverlay for fpc
  • product performance
  • product certificate
  • data download
items method condition unit typical value
peel strength(90°)* ipc-tm-650 2.4.9d accepted n/mm 1.2
288℃、5s 1.1
solder resistance ipc-tm-650 2.4.13.f 288℃、10s -

no delamination

dimensional stability sy method
after peeling off the paper
% -0.0083/-0.0021
chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >90
electric strength ipc-tm-650 2.5.6.2a d-48/50 d-0.5/23 kv/mm 100
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 2×108
surface resistance ipc-tm-650 2.5.17e c-96/35/90
1.5×106
dielectric constant(10ghz) spdr c-24/23/50 - 3.4
dissipation factor(10ghz) spdr c-24/23/50
- 0.017
resin flow ipc-tm-650 2.3.17.1 180℃/10 60s,100kg/cm2
mm <0.15
flammability ul94 e-24/125 rating v-0

remarks:

*testing after laminating with shining side of copper foil in suitablecondition

1.certified to ipc-4203/2 epoxy adhesive on one or twosides of poyimide dielectric

2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.

网站地图