shengyi technology co., ltd.-小9直播体育免费直播下载ios




●  halogen free, flammabilityul94 v-0.

●  high bonding strength, gooddimensional stabilityand thermal resistance.

●  low adhesive flowing, good processability,suitablefor both fast andtraditional lamination style.

●  compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde,etc..

application area

coverlay for fpc.
  • product performance
  • product certificate
  • data download
items method condition unit typical value
peel strength(90°)* ipc-tm-650 2.4.9d accepted n/mm 1.05
288℃、5s 1.07
solder resistance ipc-tm-650 2.4.13.f 288℃、10s -

no delamination

dimensional stability sy method after peeling off the paper
% 0.0158/0.0404
chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >90
electric strength ipc-tm-650 d-48/50 d-0.5/23 kv/mm 110
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 4.8×108
surface resistance ipc-tm-650 2.5.17e c-96/35/90
dielectric constant(10ghz) spdr c-24/23/50 - 3.3
dissipation factor(10ghz) spdr c-24/23/50
- 0.017
resin flow ipc-tm-650 180℃/10 60s,100kg/cm2
mm <0.15
flammability ul94 e-24/125 rating v-0


*testing after laminating with shining side of copper foil in suitablecondition

1.certified to ipc-4203/2 epoxy adhesive on one or twosides of poyimide dielectric

2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.