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●  low dielectric constant,low dissipation loss.

●  excellent thermal resistance,chemicalresistance and electrical property

●  halogen-free, flammabilityul94 v-0

●  good processability,suitablefor both fast andtraditional lamination style

●  compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde,etc..

application area

be used in high frequency fpc and rigid-flex pcb
  • product performance
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items method condition unit typical value
peel strength(90°)* ipc-tm-650 2.4.9d accepted n/mm 0.92
288℃、5s 0.92
solder resistance ipc-tm-650 2.4.13.f 288℃、10s -

no delamination

dimensional stability sy method
after peeling off the paper % -0.0223/-0.0393
chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >85
electric strength ipc-tm-650 d-48/50 d-0.5/23 kv/mm 98
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 4.19×109
surface resistance ipc-tm-650 2.5.17e c-96/35/90
dielectric constant(10ghz) spdr c-24/23/50 - 2.7
dissipation factor(10ghz) spdr c-24/23/50
- 0.004
resin flow ipc-tm-650 180℃/10 60s,100kg/cm2
mm <0.15
flammability ul94 e-24/125 rating v-0


*testing after laminating with shining side of copper foil in suitablecondition

1.certified to ipc-4203/21 poyimide dielectric with polyimide adhesive

2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.