shengyi technology co., ltd.-小9直播体育免费直播下载ios

product

sf230

characteristic

●  low dissipation loss  approach to lcp

●   excellent soldering reliability,dimensionalstability,chemical resistance andelectrical properties.

●  halogen-free, flammabilityul94 vtm-0.

●  compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde,etc..



application area

be used in high frequency multi-layer fpcand rigid-flex pcb as the bonding lay
  • product performance
  • product certificate
  • data download
items method condition unit typical value
peel strength(90°) ipc-tm-650 2.4.9d accepted n/mm 1.36
288℃、5s 1.47
solder resistance ipc-tm-650 2.4.13.f 288℃、10s -

no delamination

dimensional stability ipc-tm-650 2.2.4b after etched
% 0.0149/-0.0360
chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >95
electric strength ipc-tm-650 2.5.6.2a d-48/50 d-0.5/23 kv/mm 200
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 1.2×109
surface resistance ipc-tm-650 2.5.17e c-96/35/90
4.5×106
dielectric constant(10ghz) spdr c-24/23/50 - 3.2
dissipation factor(10ghz) spdr c-24/23/50
- 0.005
folding endurance jis c-6471 r0.8×4.9n
times >200
flammability ul94 e-24/125 rating vtm-0

remarks:

1.certified to ipc-4204/11 copper clad adhesiveless

2.all the typical value listed above is for your reference only,please turn to shengyi technology co., ltd. for detailed information, and all rights from this data sheet are reserved by shengyi technology co., ltd.

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