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●halogen free and phosphorusfree, ul94 v-0.

●high bonding strength, gooddimensional stability

●excellent solderingreliability, chemical resistance  andelectrical properties.

●low adhesive flowing, good processability,suitable for both fast and traditional lamination style.

●compatible with eu rohs directive, free of pb,hg,cd, cr6 ,pbb,pbde,etc..

application area

coverlayfor fpc.

  • product performance
  • product certificate
  • data download
items method condition unit typical value
peel strength (90°)* ipc-tm-650 2.4.9d accepted n/mm 1.13
288℃, 5s 1.17
solder resistance ipc-tm-650 2.4.13.f 288℃, 10s - no delamination
dimensional stability sy method after peeling off the paper
% 0.0313/0.0415
chemical resistance ipc-tm-650 2.3.2g after chemical exposure % >90
electric strength ipc-tm-650 d-48/50 d-0.5/23 kv/mm 105
volume resistivity ipc-tm-650 2.5.17e c-96/35/90 mω-cm 2.0×106
surface resistance ipc-tm-650 2.5.17e c-96/35/90
dielectric constant (10ghz) spdr c-24/23/50 - 3.27
dissipation factor (10ghz) spdr c-24/23/50
- 0.019
resin flow ipc-tm-650 180℃/10 60s,100kg/cm2
mm <0.15
flammability ul94 e-24/125 rating v-0


* certified toipc-4203/2 epoxy adhesive on one or two sides of poyimide dielectric andshengyi standard.