shengyi technology co., ltd.-小9直播体育免费直播下载ios

product

st115g

characteristic

● excellent heat dissipation

● excellent thermal and insulation reliability

● lower z-axis cte., high cti

● halogen-free, tg 175℃(dma)

application area

● pcb heat dissipation solution

● automotive electronics, led headlamp

● consumer electronics(intelligent terminal, ssd)

  • product performance
  • product certificate
  • data download
items method condition unit typical value
thermal conductivity astm-d5470 a w/ (m•k) 1.6

astm e1461 a
2.0
tg 2.4.25d dsc 170
td
2.4.24.6 wt 5% loss 410
thermal stress 2.4.13.1 288℃, solder float min
>30
cte (z-axis) 2.4.24 before tg ppm/℃ 37
after tg ppm/℃ 166
50-260℃ % 2.2
volume resistivity 2.5.17.1 c-96/35/90 mω/cm 108
surface resistivity
2.5.17.1
c-96/35/90 107
dielectric breakdown 2.5.6 d-48/50 d-0.5/23 kv >45
peel strength (1oz) 2.4.8 288℃/10s n/mm 1.05
flammability
ul94
c-48/23/50
rating
v-0
water absorption ipc-tm-650 2.6.2.1
e-1/105 d-24/23 % 0.11
cti iec60112 a rating plc0

remarks:

remarks:

1. all the typical value is based on the 1.0mm specimen, while the tg is for specimen≥0.50mm.

2.all the typical values listed above are for your reference only and not intended for specification. please contact shengyi technology co., ltd. for detailed information. all rights from this data sheet are reserved by shengyi technology co., ltd.

3. ul certificated single/double side pcb min. thickness 0.38mm.

explanation: c=humidity conditioning, d=immersion conditioning in distilled water, e=temperature conditioning

the first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

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